| 摘要 |
PURPOSE:To provide a lead frame having high adhesive properties with sealing resin and high reliability in the case of enhancing its density. CONSTITUTION:A plurality of recesses (h) are arranged on a region except an extension line of a support bar 17 of a die pad 11. A lead frame has an uneven part arranged on the pad, and a through hole formed at least partly on an extension line of the bar of the pad.
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