| 摘要 |
PURPOSE:To flatten the formation of a conducting pattern, and simplify a manufacturing process, by a method wherein the conducting pattern is formed by forming a metal catalyst layer and laminating a conducting layer on the upper layer of the metal catalyst layer by electroless plating. CONSTITUTION:A resist layer 7 is laminated on the upper surface 1A of a substrate 1 by masking, and a metal catalyst layer 2 is formed by sputtering so as to cover the resist layer 7. The metal catalyst layer 2 is patterned by lift-off eliminating the resist layer 7. An insulating barrier layer 5 is formed by spreading insulating material like polyimide and curing it. Finally, a conducting layer 3 composed of excellent conducting material is laminated on the upper layer of the metal catalyst layer 2 by electrolness plating, and a first conducting pattern 4-1 is formed in a valley part 6 formed by the insulating barrier 5. Further the resist layer 7 is laminated on the first conducting pattern 4-1 by masking, and a second conducting pattern 4-2 is formed in the similar manner to the above process, thereby flattening the conducting pattern formation. |
