| 摘要 |
PURPOSE:To make adhesion of base metal uniform, increase adhesion, and stabilize the external appearance of a copper circuit after reduction process, in the reduction process after oxidation process of inner layer material. CONSTITUTION:After copper oxide is formed on the surface of acopper circuit of inner layer material used as constituent material of a multilayer board, the surface of the copper oxide is coated with base metal. By using acid the base metal is dissolved from the surface of the copper oxide, and at the same time, the copper oxide is reduced to cuprous oxide or metal copper by using nascent hydrogen derived from the reaction between the acid and the base metal. In this reduction method, two or more screws as stirrers are installed. Each of the screws has three or more blades. The screws are arranged in an adhesion vessel in the manner in which the directions of the blades 1 to screw shafts 2 and the rotating direction are alternately different. |
