| 摘要 |
PURPOSE:To obtain a highly densified semiconductor device causing no short- circuit due to abutting of a semiconductor chip and a tape lead by preventing displacement of the semiconductor chip at the time of resin molding in relation to the semiconductor device having a plurality of semiconductor chips. CONSTITUTION:A package 7 includes the first and second semiconductor chips 3a, 3b. The conducting chips 5a, 5b, 15a, 15b are electrically connected to the respective fixed positions of the first and second semiconductor chips 3a and 3b to be in continuity to the outside of the package 7. An insulating member 12 is interposed between the first semiconductor chip 3a and the second semiconductor chip 3a. Thereby, the first semiconductor chip 3a does not abut on the second semiconductor chi 3b while the conductive members 5a, 5b, 15a, 15b do not abut on the positions excepting the respective fixed positions of the first and second semiconductor chips 3a, 3b. |
