| 摘要 |
PURPOSE:To provide a semiconductor device which has a high degree of freedom of designing a logic IC and can operate at a high speed. CONSTITUTION:An insulation tape 6 is stuck to the surface of an inner lead 1 to which a wire is not to be bonded 4 and a functional surface side of a silicon chip is stuck to the surface of the tape 6 to which the lead 1 is not stuck 1 at the center between the leads 1 in a semiconductor device. Thus, electrode pads are disposed at arbitrary places of the chip 3, coupled to the leads 1 through sufficient insulation by wires, the design of the chip is facilitated, and a high speed processing is performed. |
