| 摘要 |
PURPOSE:To provide a flip chip bonding method through which a bare semiconductor device (LSI or the like) is directly mounted on a circuit board, where cracks or fractures are less liable to occur to a soldered joint, and the soldered joint is protected against crash and damage directly caused by a cooling piece. CONSTITUTION:In a flip chip bonding method where a flip chip cooled by a heat dissipating piece is soldered to a circuit board 20, a plate 11 provided with a projection 12 which is not melted at a soldering temperature is interposed between a flip chip 14 and a heat dissipating piece 25, the plate 11 is jointed to the flip chip 14 with a joining material 13, the flip chip 14 is soldered to the circuit board 20 through the intermediary of solder bumps 16 and 22, and soldered joints 23 are constricted in the middle as the projections 12 are kept in contact with the circuit board 20.
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