| 摘要 |
PURPOSE:To provide copper conductive paste which can form a ceramic substrate and a conductive coating film in a one-time firing process, and can realize the increase of bonding strength of the formed conductive coating film. CONSTITUTION:Copper conductive paste is applied on a ceramic green sheet, and is fired on a ceramic substrate at the same time when the ceramic green sheet is fired. The copper conductive paste contains copper powder and boron- silicate zinc glass frit as a solid component. The containing ratio of the glass frit in the solid component is within the range from 0.5wt.% to 8wt.%. |
