| 摘要 |
PURPOSE:To form a package thin by a method wherein a bonding plane is provided to the bonding pad of a semiconductor pellet as recessed. CONSTITUTION:A bonding plane 1 is provided to a semiconductor pellet 3 as recessed from the upside 3a of the pellet 3. Therefore, a the height of bonding loop can be lessened by a level difference between the upside 3a and the bonding plane 1. Moreover, when the height of the peripheral part of a pellet is lessened, including the bonding plane 1, the same effect as above can be obtained. By this setup, the loop of a bonding wire 2 becomes low, whereby a package can be made thin by the use of a conventional bonding device without changing the loop of the bonding wire 2 in shape. |
