Connection between metallic and ceramic material

摘要

The binding metal layer on loading is deformed plastically at a tension which is lower than that at hwich breakage occurs in the ceramic material. In the process of producing a mechanically strong, electrical conductive connection between the metallic and ceramic materials, the union is effected by soldering in a reducing atmosphere. The atmosphere is of gas, comprising at least 5 vol.% hydrogen, with the remainder being mainly nitrogen or inert gas. A non-alloyed metal is used as solder, and has a melting point of over 900 deg.C., i.e. silver is a preferred solder. The ceramic material consists of molybdenum disilicide.