| 摘要 |
<p>Disclosed is a method for fabricating devices, and the resulting products, using Tape Automated Bonding (TAB) technology. Via holes (30) are formed through a flexible insulating layer (11), such as polyimide, and are plated through when conductive fingers (12) are formed on one surface of the layer. The resulting structure is then bonded to a semiconductor chip (41) by means of the conductive pads (20) formed on the surface of the insulating layer opposite to the conductive fingers. <IMAGE></p> |
