| 摘要 |
A process for manufacturing a printed-circuit board comprising rigid and flexible parts, by the compression of rigid and flexible individual layers and the removal of rigid parts in the zones which are desired to be flexible consists in that, after the construction of the weak points, which delineate the part which is to be made flexible, an insulation film is bonded onto the rigid individual layer on the circuit side, and only in the part which is to be made flexible, by means of a non-flowing adhesive layer, the insulation film projecting somewhat on all sides beyond the dimensions of the flexible part, in that the insulation film is provided with an additional adhesive layer on its side facing away from the individual layer, in that a prepreg, which is of equal thickness or is a few mu m thicker than the insulation film including the adhesive coating, is applied in a covering manner thereon, the prepreg being cut out in the flexible part, in that a continuous copper foil is then placed over the complete prepreg, in that the composite is compressed under pressure and at a temperature which activates the adhesive and bonds the prepreg to form a laminate, the adhesive bond is allowed to cure and, after producing the conductor pattern and machining the contours, the individual layer with the copper coating is finally removed in the flexible part, along the weak points. |
