| 摘要 |
<p>Method and apparatus for cutting a cylindrical material (10, W) formed of silicone or the like which is an original material to produce semiconductor devices, using a rotary blade (12, 140). In the cutting method, the base end side of the cylindrical material is fixed and at the same time, before the cutting of the cylindrical material (10, W) is started, the cutting side of the cylindrical material (10, W) is also fixed according to the shape thereof. The cutting is performed while maintaining such fixed conditions until the cutting is completed.</p> |
