ELECTRONIC PART STRUCTURE BUILT-IN IN-MOLD PRODUCT AND PRODUCTION THEREOF

摘要

PURPOSE:To obtain an electronic part structure built-in in-mold product easily attaining to make machinery compact as compared with a conventional IC fixing method, hardly generating the release of parts or the cutting 6f IC lead wires and capable of simplifying a manufacturing process. CONSTITUTION:An in-mold product having an electronic part structure such as a mounting board built therein is constituted by the in-mold integral molding of a printed wiring board 2 having parts 3 such as an IC or the like mounted thereon and a long fiber reinforced resin 1 and has bending modulus of 300kgf/ mm<2> or more and bending strength of 5kgf/mm<2> or more. This in-mold product is produced by laminating a long fiber reinforced thermosetting resin prepreg 4 to the single surface or both surfaces of the electronic part structure 2 such as the mounted printed wiring board under heating and pressure.