发明名称 HEAT-RESISTANT INSULATING FILM
摘要 PURPOSE:To improve heat resistance by forming a mixture of a propylene/ alkenylsilane copolymer and a specific compound into a sheet or film, stretching it, and treating the resulting film with a solution of a transition metal compound. CONSTITUTION:Propylene is copolymerized with 0.001-30mol% alkenylsilane in the presence of a catalyst comprising a transition metal compound and an organometallic compound to obtain a propylene/alkenylsilane copolymer having an intrinsic viscosity (at 135 deg.C in tetralin) of 0.1-10. A mixture of 100 pts.wt. this copolymer and 0.01-10 pts.wt. compound having at least two unsaturated bonds is melt-molded into a sheet or film, which is stretched at least monoaxially to obtain a film having a thickness of 1-300mum. The film is immersed in a solution containing 0.000001-0.1g/l transition metal compound at ordinary temp. to 200 deg.C for several minutes to tens of hours.
申请公布号 JPH05230250(A) 申请公布日期 1993.09.07
申请号 JP19920033030 申请日期 1992.02.20
申请人 MITSUI TOATSU CHEM INC 发明人 ASANUMA TADASHI;YAMAMOTO KAZUHIKO
分类号 C08J3/24;C08J5/18;C08J7/06;C08J7/12;C08K5/01;C08L23/00;C08L23/14 主分类号 C08J3/24
代理机构 代理人
主权项
地址