| 摘要 |
PURPOSE:To obtain a wiring board with high accuracy and superior heat resistance by joining a photosensitive resist film contg. a diallyl phthalate prepolymer with a specified mol.wt., a photopolymerizable monomer and a photopolymn. initiator as principal components to a laminated board coated with an adhesive contg. a catalyst, and using the resulting material. CONSTITUTION:A photosensitive resist film contg. a diallyl phthalate prepolymer with about 3,000-about 20,000mol.wt., a photopolymerizable monomer and a photopolymn. initiator as principal components is superposed on a laminated board coated with an adhesive contg. a catalyst after piercing holes in the board by drilling or other method, and they are joined together by heating and pressurization. The film is exposed through a transparent negative, optionally heat- treated, and developed. The developed film is cured by heat treatment or irradiation with ultraviolet rays. Electroless copper plating is carried out using the resulting permanent insulating film as a mask to form a conductor circuit, and finally irradiation with ultraviolet rays or heat treatment is carried out. Thus, a printed wiring board having superior solvent resistance and proof against soldering temp. is obtd. by repeating heat treatment or irradiation with ultraviolet rays twice. |
