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发明名称
EPOXY RESIN MOLDING MATERIAL FOR SEALING
摘要
申请公布号
JPH05230173(A)
申请公布日期
1993.09.07
申请号
JP19910160730
申请日期
1991.07.02
申请人
MATSUSHITA ELECTRIC WORKS LTD
发明人
SAKAMOTO TAKASHI;KIYOUGAKU MASAYUKI;HARA RYUZO;TORII MUNETOMO
分类号
C08G59/20;C08G59/00;C08L63/00;H01L23/29;H01L23/31
主分类号
C08G59/20
代理机构
代理人
主权项
地址
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