SEMICONDUCTOR DEVICE AND PRODUCTION THEREOF

摘要

PURPOSE:To efficiently produce a card strong against the stress in a process for producing the functional part of a thin semiconductor device such as an IC card and use environment. CONSTITUTION:A resin receiver 8a discharging excessive foamable resin 9 is provided to the outer skin container 7 forming the outer shape of a thin semiconductor device such as an IC card and, after a printed circuit board 2 and functional parts are received in the container, the outer skin container 7 is filled with the foamable resin 9 to perfectly embed the functional parts in the resin and the excessive resin is discharged to the resin receiver 8a through a passage 8.