| 发明名称 |
CLEAVABLE DIEPOXIDE FOR PROTECTING REMOVABLE DEVICE IN ELECTRON PACKAGING |
| 摘要 |
<p>Chips mounted into substrates are often encapsulated with a cured epoxy which is insoluble. The invention herein is the discovery that diepoxides with ketal linkages are soluble. This permits encapsulating chips, testing them for goodness and removing the chips for rework by dissolving the epoxy without destroying the chip or substrate. <IMAGE></p> |
| 申请公布号 |
JPH05230335(A) |
申请公布日期 |
1993.09.07 |
| 申请号 |
JP19920207844 |
申请日期 |
1992.08.04 |
| 申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
SUTEIIBUN RESURII BUTSUKUUOORUTAA;ROORA RUIIZU KOSUBAA;BAATO HARISON NIYUUMAN;FURANKU RUISU PONPEIOU |
| 分类号 |
C08G59/02;C07D303/24;C08G59/00;C08G59/18;C08G59/22;C08G59/24;C08G59/42;C08G59/50;C08L63/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/02 |
| 代理机构 |
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