| 摘要 |
An automated excise-form and shuttle system and apparatus for surface mount electronic components. The apparatus comprises an electronic stepper motor which turns a lead screw to move a die shuttle mounted on a rail on the base. The shuttle has a precision lead screw nut mounted thereon which allows the shuttle to move by turning the lead screw. The shuttle rides on ball bearings which are mounted inside the shuttle with the shuttle and ball bearings moveable secured to the rail. A die shuttle utilizing a mechanical elevating and retracting cam system drives a load arm attached to a die plate to shuttle the component to a die assembly for trim and form functions. The lead screw slideably moves the excised component from a present station where a pick-up device removes the component. An automated method for excise-form function for surface mount electronic components comprising moving a surface mount electronic component to a presentation position, ejecting a carrier ring, feeding the surface mound electronic component into a die shuttle, trimming and forming leads on the surface mount electronic component, presenting the surface mount electronic component to a pick-up station, and moving the surface mount electronic component from the pick-up station by a pick up apparatus is also disclosed.
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