发明名称 |
MANUFACTURE OF MULTILAYER WIRING BOARD |
摘要 |
PURPOSE:To improve productivity by effectively etching an electric insulating layer in the case of manufacturing a multilayer wiring board and manufacturing the board with high reliability. CONSTITUTION:A method for manufacturing a multilayer wiring board has the step of forming conductor patterns 12 in multilayers in an electric insulating layer 14. A lower conductor layer 22 is covered with a base discriminating layer 24 having different color tone from that of a conductor layer 22, and the layer 14 for electrically insulating between the layers is formed on the layer 14. The layers 14, 24 are etched by identifying color tones of the layers 22 and 24 to form a conduction hole 16 for forming a conductive part for electrically connecting the patterns 12 between the layers, a conductor is formed in the hole 16, thereby providing a conductive part 18. |
申请公布号 |
JPH05226843(A) |
申请公布日期 |
1993.09.03 |
申请号 |
JP19920058915 |
申请日期 |
1992.02.12 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
YOSHITANI MASAAKI;IIJIMA TAKAHIRO;WAKABAYASHI SHINICHI |
分类号 |
H05K1/02;H05K3/00;H05K3/24;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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