| 摘要 |
PURPOSE:To completely connect the electrode of a semiconductor element and the electrode of a circuit substrate without defective electrical connection due to deviation of conductive particles by a method wherein a bonding agent is coated in an extremely efficient and uniform manner, and conductive particles are selectively transferred. CONSTITUTION:In the mounting method for a semiconductor element on a circuit substrate through conductive fillers, the bonding agent feeding path 14, in which a recessed part is formed in the same pitch as the electrode part of a semiconductor element 21, and the recessed part of an intaglio printing jig with a resin recovering circuit are aligned in such a manner that they are brought in coincidence with the electrode 18 of a circuit substrate 17, and a bonding agent is fed from the bonding agent feeding hole 15 of the intaglio printing jig. Further, the excessive bonding agent is recovered from a bonding agent recovering hole 16, a bonding agent 19 is transferred to the electrode 18 only of the circuit substrate 17 on which the semiconductor element 21 will be mounted, conductive particles 20 are applied to the electrode part of the circuit substrate 17, the conductive particles 20 are temporary fixed only to the part having the bonding agent 19 util izing the adhesive power of the bonding agent 19, the semiconductor element 21 is aligned corresponding to the electrode part of the circuit substrate, it is pressure-connected, fixed by sealing resin and mounted.
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