发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To make it possible to conduct a wire bonding operation while the bending of the wire itself is being removed by annealing by a method wherein a tube body, with which the wire is passed through the path of a bonding wire, and a heating means, with which the wire in the tube body is heated up, are provided. CONSTITUTION:A tube body (glass tube) 20 is provided, through which a wire (gold wire) 2 is passed between a wire guide 4 and a cut clamp 5. In order to heat up the gold wire in the above-mentioned glass tube 20, a heater coil 21, which is wound around the outer circumference of the glass tube 20, is provided and a temperature control unit 22, with which the temperature in the glass tube will be controlled by applying a high frequency current to the coil 21, is provided. The gold wire 2 is heated up in the glass tube 20 by a tension mechanism 3 with which gas is allowed to flow out at constant pressure. As a result, the bending of the wire itself can be removed by annealing. Also, a loop-type wire can be obtained even when the wire is long.
申请公布号 JPH05226402(A) 申请公布日期 1993.09.03
申请号 JP19920029834 申请日期 1992.02.18
申请人 NEC CORP 发明人 TAKIZAWA TORU
分类号 H01L21/60 主分类号 H01L21/60
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