| 摘要 |
PURPOSE:To prevent recesses or holes from occurring in a resin-sealed part so as to obtain a semiconductor device high in manufacturing yield by a method wherein the width of the corner of a sealing base is set inwardly larger than that of the corner of a sealing cap. CONSTITUTION:The width of a sealing surface 14a of a base 14 is set inwardly larger than that of a sealing surface 15a of a cap 15, R of the corner of the sealing surface 15a is set to over 0.8mm. The ends of leads penetrating between the sealing surfaces 14a and 15a are made to extend up to the corners of the sealing surfaces 14a and 15a and formed. Resin applied onto the sealing surfaces 14a and 15a of the base 14 and the cap 15 which seal off a chip is set to have a viscosity of 2000-3000 poises and a fluidity ratio of 15-25. By this setup, leads are prevented from being exposed, and recesses or holes are restrained front occurring in a sealing part, so that a semiconductor device excellent in quality and manufacturing yield can be obtained. |
