| 摘要 |
PURPOSE:To improve the accuracy of resist pattern by blowing a developer from the lower side of a wafer with coated resist to prevent the bottom sagging of the resist. CONSTITUTION:In a producing step of semiconductor products, the wafer with coated resist 4 is developed by blowing the developer from the lower side of the wafer 4. As the wafer with resist faces downward and the developer 1 is blown from lower side against the surface of the resist, a semiconductor circuit pattern after developing is pulled down by the own weight of the resist and the bottom sagging of the pattern is prevented. Then, a problem that a accurate pattern is hardly made because of the bottom sagging of the resist due to the own weight of the resist is solved. |
