| 摘要 |
<p>PURPOSE:To prevent flowing and dropping of melted resin, to eliminate remainder of a resin piece in a device, to obviate a hitting mark on a printed wiring board and to press-bond the board by a uniform pressing force by forming a frame for surrounding a region to be placed with the board. CONSTITUTION:A frame 4 is so provided as to surround a region to be placed with a printed wiring board 3 of a body 1. A height of the frame 4 is formed to be slightly lower than the height of the stacked boards 3. Thus, the frame 4 is provided on the body 1 to stop thermosetting resin 5 flowing from the laid board 3 by the frame 4, thereby preventing adherence to a hot board. Thus, hitting mark to the board 3 by a resin piece is eliminated, and the board can be uniformly thermo-compressed.</p> |
