MANUFACTURE OF MULTILAYERED CIRCUIT BOARD

摘要

PURPOSE:To remove moisture completely from through holes in a multilayered circuit board. CONSTITUTION:A device 1 is used to remove moisture from a multilayered circuit board 7. The device is connected through a condenser 3 to a Roots pump 5 for drying it in a vacuum. The inside of the device is heated by an infrared heater 2 to help evaporate moisture inside so that moisture may be removed from the circuit board. The condenser connected between the device 1 and the Roots pump 5 is cooled by circulating water from a water cooler 6. The vapor in the device 1 is reduced in the condenser, and the condensate runs into a tray, from which it is discharged.