| 摘要 |
PURPOSE:To avoid the needless runout of solder bump in case of mounting an IC chip. CONSTITUTION:Within the title connection structure, a wiring board 17 is composed of a board main body 11 whereon a wiring pattern 12 is formed, a bump electrode 14 comprising copper is formed on the surface of a connecting part 12a of the wiring pattern 12 while an insulating layer 16 is formed on the specific part of the board main body 11 including the wiring pattern 12. Furthermore, the connecting electrode 19 of an IC chip 18 is connected to the whole surface of the metallic layer 15 of the wiring board 17 by thermocompression bonding through the intermediary of the previously provided solder bump 20 so as to mount the IC chip on the wiring board 17. At this time, the solder bump 2 once melted down during the thermocompression bonding can be prevented from running out of the surface end part of the metallic layer 15 by the surface tention thereby enabling the needless runout of the solder bump 20 to be avoided. |
