| 摘要 |
PURPOSE:To make the title semiconductor device adaptable to various kinds of packages and frames by providing a plurality of bonding pads which are not corresponding to each specific outer terminal and can be selectively connected to each circuit terminal on a chip. CONSTITUTION:For example, a frame, having the lead arrangement as shown in (a) of the diagram, is used. In this case, as each lead 1 is connected to the corresponding input-output buffer 4 respectively, suitable bonding 2b, 2c, 2e, 2h and 2i are selected from all bonding pads, and they are connected to each input-output buffer 4 by a wiring 7. Inspite of the arrangement of the same bonding pad 2, it can be adapted for a number of packages and frames. |
