| 摘要 |
PURPOSE:To facilitate a method of manufacturing a lead frame, for semiconductor device use, wherein the peripheral part in an island to which a semiconductor device is die-bonded is made wide and a joining electrode part is formed in the peripheral part via an insulator layer, to simplify the processes of the manufacturing method and to raise the productivity of the manufacturing method. CONSTITUTION:The title manufacture comprises a process wherein an insulator layer 7, e.g. an organic substance layer such as of a heat-resistant polymer compound, especially a polyimide layer, is formed, by a printing method, in the peripheral end part on an island 1 so as to surround a semiconductor integrated circuit chip 2 and a joining electrode part 8 is formed on the insulator layer 7. |
