| 摘要 |
PURPOSE:To provide a semiconductor package wherein an integrated circuit chip provided with bonding pads the number of which larger than the number of pins can be sealed without lowering its mounting efficiency. CONSTITUTION:A semiconductor chip 10 is provided with 17 bonding pads A to Q. On the other hand, 14 pins 141 to 1414 and 17 leads 161 to 1617 are installed on a semiconductor package 12. Consequently, a plurality of leads out of the leads are connected singly to the pins by means of interconnections at the inside of the package. When the pads B, C, P are used as power-supply pads and the pads K, L are used as grounding pads, the leads 162, 163, 1616 which are connected to the power-supply pads B, C, Pare connected to the pin 144, and the leads 1611, 1612 which are connected to the grounding pads K, L are connected to the pin 1412. |
