| 摘要 |
PURPOSE:To improve yield when a surface package element is soldered to a printed wiring substrate. CONSTITUTION:After a surface package element 10 is placed on a printed wiring substrate 50 with leads 11, 14 formed of iron in proximity to soldering pads 51, 54 also formed of iron, respectively, magnetic poles 70, 71 are made close from up and down each other to place the leads 11, 14 and the soldering pads 51, 54 in a magnetic field. The lead 11 and the soldering pad 51, and the lead 14 and the soldering pad 54 are attracted each other and the surface package element 10 is positioned. |
