INTEGRATED OPTICAL CHIP FOR LITHIUM NIOBATE SUBSTRATE AND LASER MELT AWAY METHOD FOR MOUNTING OPTICAL FIBER THEREON

摘要

PURPOSE: To provide a method for attaching an optical fiber to an optical integrated circuit chip. CONSTITUTION: An oblong hole 14 formed at the edge of a substrate 12 made of lithium niobate (LiNbO3 ) having at least one optical waveguides 15 has an end wall 18 to expose the end face of the optical waveguides formed at a certain end face angle with the optical axis of propagation. The optical fiber 20 has the end face formed at the certain end face angle with the propagation direction of the light in the optical fiber. The optical fiber 20 is so positioned in the oblong hole at the end face butted and coupled against and to the end face of the optical waveguides 15 so as to form a joint surface to the extent that the light can propagate between the optical waveguides 15 and the optical fiber 20. The optical waveguides 15 extend to the input branch point of the central waveguide and the detecting waveguide. First and second barrier deep grooves or grooves are formed adjacently to the central waveguide substantially parallel therewith and are offset from the waveguide by a predetermined distance.