发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE USE
摘要 <p>PURPOSE: To improve adhesive and mechanical strengths of multiple inner leads with inner ends by vertically cross-linking anchor holes with at least one almost semi-circular recess to their adjacent leads and by forming an anchor hole pattern which is a surface with almost semi-circular wells by etching. CONSTITUTION: A lead frame is provided with a die pad 2, supported by two or more die bars 29, multiple conductive inner leads 24 with inner ends 28, aligned toward the perimeter of the die pad 2 and one or more anchor holes 27 adjacent to each other on the multiple inner leads 24. A die bar 26 forms a boundary between the inner leads 24 and outer leads 25. The lead frame is etched for obtaining a specified diameterϕC, so that a surface 31 with wells with a constant pattern is formed. The surface of the underside is etched to obtain a specified diameterϕD to form the surface 31 with wells. Anchor holes 24 with a specified diameterϕE are formed in inner leads 30.</p>
申请公布号 JPH05226548(A) 申请公布日期 1993.09.03
申请号 JP19920316943 申请日期 1992.11.26
申请人 SAMSUNG ELECTRON CO LTD 发明人 AN MINNCHIYORU;KEN NEIDO
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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