| 摘要 |
PURPOSE:To realize a circuit board of high productivity and dense wiring by forming through conductors in a laminate of thin insulating sheets having wiring patterns with thin adhesive sheets interleaved. CONSTITUTION:Thin insulating sheets 1 having wiring patterns 3 are laminated by interposing thin adhesive sheets 2, and a through conductor 4 is provided in the laminate. The insulating thin sheet 1 is composed of polyimide having a repetitive structure as shown by the formula I (where x is residual aromatic diamine). The adhesive sheet 2 is composed of an ether bismaleimide compound as shown by the formula II (R1 and R2 are any of H, lower alkyl, and lower fluoroalkyl; m=1 to 4; R3 and R4 are CH3 or CF3, being the same or different). A circuit board of this structure is easily subjected to a pattern test, and high yield and reliability can be achieved. |
