| 摘要 |
<p>PURPOSE:To enable the multilayered circuits to be manufactured at high yield within a short time by a method wherein the multilayered circuits are collectively laminated similar to the thick film multilayered circuit board and a printed circuit board furthermore highly integrated similar to the thin film circuit. CONSTITUTION:Respective laminated sheets are formed of one sheet in a circuit comprising at least one layer of wiring layer spread out in a plane direction and a via wiring layer connecting to the wiring layer in the vertical direction. In the respective sheets, an easily plastic-deformed conductor is formed on the conductor parts of via or wiring on the surface and rear surface of the sheet otherwise protrusions are formed of another conductor more hardly plastic- deformed then the conductor. Furthermore, respective sheets individually formed are laminated to be pressurized or heated so that the easily plastic-deformed conductor and the other more hardly platic-deformed conductor may be electrically connected to attain to the multiplication of the circuits.</p> |
