PHENOL FORMALDEHYDE STEAM PRESSING OF WAFERBOARD

摘要

The present invention relates to a method of producing a waferboard by apply ing first a liquid phenol formaldehyde resin (12) to the surface of the wafers (10) then a powdered phenol formaldehyde r esin (14) followed by forming a layup (16) and pressing at elevated temperature and pressure using steam pressing technique s (18) to consolidate the layup into a board and set the phenol formaldehyde adhesive.