SEMICONDUCTOR DEVICES AND METHODS OF MASS PRODUCTION THEREOF

摘要

A semiconductor device (10) includes a semiconductor substrate (12) forming the bottom portion of a package (14) of the device and a ceramic plate (34) forming the upper or lid portion (16) of the device. The substrate includes a layer of metal (32) on its upper surface (28) along the substrate outer edge and spaced apart from the electrodes (24) on the substrate upper surface. The ceramic plate includes a copper foil (26) on its lower surface along the outer edge thereof which overlaps and is bonded to the substrate metal layer. The ceramic plate has apertures (36) therethrough which are sealed by copper foils (40, 44) on the inside of the package, the foils being bonded to respective ones of the substrate electrodes. A method of assembly comprises forming an array of integrally connected lids and an array of integrally connected substrates, each of the arrays including the aforementioned layers and foils, bonding the arrays together to form an array of devices, and dicing the bonded together arrays to provide individual devices.