| 摘要 |
PURPOSE:To heighten the measuring resolution and accuracy of a bonding location by a mechanism wherein a ring lens, central portion thereof has a measuring hole, is disposed to an upper portion of the bonding location, lights from a light source are condensed, and the bonding location is illuminated. CONSTITUTION:Bonding is performed in such a manner that an arm 6 with a capillary 5 to which a bonding wire 3 from a spool 4 is inserted is advanced to an electrode of a semiconductor element 1 fastened onto a lead frame 2 from the lateral direction. Since it is necessary to illuminate a bonding location at that time, the location is illuminated from an upper portion. That is, lights from a lamp 7 are changed into parallel rays by means of a condensing lens 11, and reflected by means of a reflector 12, whose center has a measuring hole 13 for passing reflecting measuring light, and the bonding location is illuminated through a ring lens 14 having similarly a measuring hole 15. The reflected light is passed through the holes 15, 13 and expanded by means of an expanding lens 9, and the location is decided by using a vidicon tube 10. Thus, illumination from the lateral direction in conventional devices is changed into illumination from the upper portion, and accuracy is improved. |
