CONNECTOR

摘要

The proposal is for a bearer, a connector and a printed circuit board or the like having at least one semiconductor chip which is connected to at least one bonding pad via bonding wires. The free regions of the semiconductor chip (1), bonding wires (5), bonding pads (2) and the surface (3) of the bearer (T) are coated with an organic protective layer (6) produced by plasma polymerisation against environmental influences. The bearer is preferably fitted in a vehicle wheel.