| 摘要 |
<p>A socket (2, 202) for interconnecting a zig-zag inline integrated circuit package (100) to a printed circuit board includes a housing (4, 204) with a plurality of terminal receiving cavities (20, 220) therein. The cavities (20, 220) are profiled in two parallel and offset rows, the rows of cavities (20, 220) being separated by a central support rib (5, 205) which extends along the axial centerline of the housing (4,204). The central support rib (5, 205) is beveled inwardly at its upper edge. The socket (2, 202) further includes a plurality of terminals (50) for disposition within the cavities (20, 220) and includes portions (74) disposed adjacent to and in a contacting relation with the corner (46, 246) formed by the beveled surface (30,230). The socket (2,202) also includes a decoupling capacitor (152), integrally mounted to the terminals (150) which contact the power and ground lead of the integrated circuit package.</p> |
