Thermosetting resin compositions.

摘要

The invention discloses a thermosetting resin composition comprising (a) a compound containing at least one epoxy group and at least one vinyl group in a molecule, (b) an aromatic amine curing agent, and (c) a radical polymerization intiator. The composition may further contain (d) a polyetherimide, or (d) and (e) a bisphenol A type epoxy compound, or (e) and (f) a polyethersulfone. The themosetting resin compositions have well-proportionate mechanical strength, toughness and thermal resistant property.