发明名称 |
LAMINATION OF A PHOTOPOLYMERIZABLE SOLDER MASK LAYER TO A SUBSTATE CONTAINING HOLES USING AN INTERMEDIATE PHOTOPOLYMERIZABLE LIQUID LAYER |
摘要 |
A process is disclosed for applying a preformed photopolymerizable solder mask film and a photosensitive liquid to a printed circuit substrate containing a plurality of holes wherein reduced failure is obtained in photopolymerized areas of the solder mask film above the holes as determined after a soldering operation. The photosensitive liquid contains at least one ethylenically unsaturated compound capable of forming a high polymer by addition polymerization and a first photoinitiator system which has an absorption maximum in a first spectral region. The preformed photopolymerizable film contains at least one ethylenically unsaturated compound capable of forming a high polymer by addition polymerization and a second photoinitiator system, such that the preformed photopolymerizable film has an absorption maximum in a second spectral region and is activated by actinic radiation therein and has an absorption minimum in the first spectral region and transmits actinic radiation therein.
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申请公布号 |
US5240817(A) |
申请公布日期 |
1993.08.31 |
申请号 |
US19910811358 |
申请日期 |
1991.12.20 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
STOUT, GARY;ASHCRAFT, ROBERT W. |
分类号 |
G03F7/16;H05K3/00;H05K3/28;H05K3/34 |
主分类号 |
G03F7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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