PREPREG FOR CIRCUIT BOARD, PRODUCTION OF PRINTED CIRCUIT BOARD USING THE SAME AND PRINTED CIRCUIT BOARD

摘要

PURPOSE:To provide prepreg for a circuit board not deteriorating suitability to electroless plating even if an adhesive layer is provided in the form of prepreg and having effective function to improve productivity and to establish a printed circuit board producing technique utilizing the prepreg. CONSTITUTION:An adhesive soln. prepd. by dispersing fine powder of a cured heat resistant resin soluble in an acid or oxidizing agent in an uncured resin matrix which is made slightly soluble in the acid or oxidizing agent when cured is impregnated into a fibrous base material to obtain prepreg for a circuit board. Epoxy resin having hydroxy-ether structure cured with an amine curing agent is used as the cured heat resistant resin. A printed circuit board is produced by utilizing the prepreg.