| 摘要 |
PURPOSE:To provide a mounting device of LED head for mounting LED array chips to the LED head, in which especially bonding operation is eliminated and which strongly withstands vibration and the like and the reliability of which is improved. CONSTITUTION:The device concerned connects driver LSI chips 2-1 to 2-n and LED array chips 3-1 to 3-n, which are provided on metal plate 1, with each other through film substrate 4. The connection is performed by thermocompression bonding under the condition that the bumps provided on the driver LSI chips 2-1 to 2-n and the anisotropic conductive parts formed on the film substrate 4 are registered each other and the bumps provided on the LED array chips 3-1 to 3-n and the anisotropic conductive parts formed on the film substrate 4 are registered each other. By the above-mentioned constitution, the connecting operation becomes easy and a device having high reliability can be produced. |
