| 摘要 |
PURPOSE:To prepare the title compsn. which gives a cured article excellent in processibility and heat resistance by compounding specific imide compds., an epoxy resin, a resin having phenolic hydroxyl groups, and a compd. having a specific naphthalene ring. CONSTITUTION:The title compsn. is prepd. by compounding an imide compd. having a maleimide group of formula I having no allyl group and an imide compd. having a maleimide group of formula II having an allyl group (A), a resin (B) having at least two epoxy groups in the molecule, a resin (B) having phenolic hydroxyl groups, and a compd. (D) which has a naphthalene ring having double bonds conjugated with an arom. group and is previously mixed into either or both of resins B and C. If a copolymer obtd. by reacting an arom. polymer with an organopolysiloxane is added to the compsn., stress occurring in a cured article made from the compsn. is reduced. |
