| 摘要 |
<p>PURPOSE:To reduce wiring space between semiconductor chips and leads, and obtain a miniaturized semiconductor device, regarding a semiconductor device having a plurality of semiconductor chips in a package. CONSTITUTION:Two semiconductor chips 3A, 3B are so arranged that the surfaces face each other, and an area TAB tape 12 is arranged between the two semiconductor chips 3A, 3B. The area TAB tape 12 is connected with bumps 4 formed on the semiconductor chips 3A, 3B, and end portions of the area TAB tape 12 are connected with outer leads 6. The semiconductor chips 3A, 3B and the area TAB tape 12 are resin-sealed with sealing resin 7. Thereby a semiconductor device 11 is constituted.</p> |
