MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

PURPOSE:To eliminate injection of resin of prepreg at the time of laminating an insulating board and to obviate necessity of forming a blind viahole by drilling after laminating in the steps of manufacturing a multilayer printed circuit board. CONSTITUTION:A blind viahole 12 having a conductor layer 13 on an inner wall is previously formed on an insulating board 11. Then, conductive resin 14 having heat resistance and chemicals resistance or resin 14 is filled in the viahole 12. After the resin 14 is filled, an etching resist layer 15 is formed, and the step of etching is executed. A plurality of the boards 11 formed with an interconnection pattern are laminated and pressed through prepreg therebetween in a state that the viahole 12 is blocked by the resin 14.