| 摘要 |
PURPOSE:To eliminate the effect of a component absorbed state, and reduce the size of a component mounting device in an attempt to mount components on a board with a specified mounting pressure. CONSTITUTION:With regards to a board to which components are to be mounted, a cylinder-shaped spindle 12 is vertically supported and pivoted on a spindle housing 11 which rises and falls in a relative manner by means of a lifting device 3 and a rod 13 having an absorption hole on the lower end is installed, which is rotatively supported inside the spindle. This rod 13 is energized by means of a spring 5 at a descent stopper inside the spindle. An air intake passage, which communicates the absorption hole of the rod with the interior of the spindle from an opening on the side of the rod, is installed. A sealing means 14, which divides a pressure chamber which applies pressure to the upper end of the rod and a vacuum chamber which evacuates the air intake passage, is installed inside the spindle. A hollow rotary shaft of a motor 16 is connected to the top of the spindle. An air pressure control means 4, which supplies compressed air into the spindle by way of the hollow rotary shaft, is installed. The vacuum chamber of the spindle is connected to a vacuum air source, thereby numerically controlling the operations of the lifting device and the air pressure control means. |
