| 摘要 |
PURPOSE: To provide a multilayer thin-film module providing a monitor for a process forming each layer, and a monitor for the whole module, containing a structure body capable of monitoring the results of additional following layers. CONSTITUTION: At the corner of each layer, a test structure body is formed as a part of a process for forming a layer. The corner test structure body is designed so as to emulate the wiring pattern of a layer. Each test site contains vias 38, 40 forming a viachain and an array of test pads 36. By the vias, the array of all the test pads is connected with a test pattern of an adjacent level. A test structural body pattern in a specific layer is subjected to access from pads of continuos level and pads on the upper surface of a completed module. |
