| 摘要 |
PURPOSE:To facilitate the packaging of an integrated circuit, and correspond with multipin, narrow pitch, and high precision, by performing electric connection via a glass substrate having a trunk electrode composed of a transparent conducting film part or a metal film part, by using bumps or anisotropic conductive resin or by wire bonding. CONSTITUTION:An integrated circuit 5 like IC and LSI is mounted on a central part, via a glass substrate having a trunk electrode composed of a transparent conducting film part (trunk electrode) 2 and a metal film part (trunk electrode) 3, which is formed on the film part 2 as the same pattern. The integrated circuit 5 is connected with the metal film part 3 by using bumps 6. The metal film part 3 is connected with inner leads 1 of a lead frame by using bumps 7. Practically by using a plating equipment, the metal film part 3 composed of nickel and gold is formed on the glass substrate having the transparent conducting film part 2. The metal film 3 is connected with the integrated circuit 5 and the inner leads 1 of the lead frame by using solder bumps. |
